• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method for contacting a component (6) embedded in a printed circuit board (13), comprising the following steps: a) providing a core (1) which has at least one insulating layer (2) and at least one conductor layer (3, 4), b) embedding at least one component (6) in an insulating layer, wherein the terminals (8) of the component lie substantially in the plane of an outer surface of the core (1) having the at least one conductor layer (4), c) applying a photostructurable lacquer ( 9) on the one outer surface by filling the spaces between the terminals (8) of the component (6), d) exposing the terminals (8) and the areas of the conductor layer (4) covered by the photopatternable lacquer (9) by exposure and development e) by applying a semi-additive process, depositing a layer (10) of conductor material on the free faces of the terminals (8) and forming a lead structure (12-12) at least on one face of the core (1) and the connection lines (11) between the terminals and the conductor structure (12-12); and f) removing the non-conductor structure (12-12) portions of the conductor layer (4 + 10).
    公开号:AT515447A1
    申请号:T50152/2014
    申请日:2014-02-27
    公开日:2015-09-15
    发明作者:Gerald Weidinger；Andreas Zluc
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    The invention relates to a method for contacting a component embedded in a printed circuit board.
    Furthermore, the invention relates to a printed circuit board having at least one insulating layer and at least one structured conductor layer with conductor tracks, with at least one embedded in the insulating layer using an adhesive layer in a recess of the printed circuit board component whose connections substantially in the plane of at least one conductor layer having outer surface of the printed circuit board lie and with conductive connections between the terminals of the device and conductor tracks of the conductor layer
    The embedding of components, in particular of semiconductor chips, in printed circuit board structures is familiar to the person skilled in the art, in which structures are considered in which the terminals of the component lie substantially in one plane on the outer surface of the printed circuit board, wherein "surface embedded components " speaks. The electrical connections of the device must be contacted with a conductor structure, for which various ways were taken.
    For example, DE 10 2006 009 723 A1 shows a method for embedding a component in a printed circuit board and for contacting it, in which a first insulating layer having a conductor structure is applied to a metallic substrate. Then, a window or a cutout for the chip is produced in the first layer and a chip is inserted into this gap leaving a gap and fixed on the substrate with the aid of an adhesive. The connections of the chip are located on a side facing away from the substrate contact side. In addition, a photostructured second insulating layer is applied, which leaves the contact points of the chip open, and then an electrical contact between the chip connections and the conductor structure on the first layer takes place by electrodeposition of a conductor material. A disadvantage of the known method or the product obtained is the fact that in the distance region between the chip and adjacent layers, a cavity remains, which can lead to delamination problems in the construction of other layers.
    An object of the invention is to provide a method by means of which a conductor structure in the plane of the terminals, including corresponding contacts, can be produced simply and cost-effectively without the risk of stripping of layers.
    This object is achieved by a method of the aforementioned type, which according to the invention comprises the following steps: a) providing a core comprising at least one insulating layer and at least one conductor layer, b) embedding at least one component in an insulating layer, wherein the terminals of the device c) applying a photostructurable lacquer to the one outer surface to fill in the spaces between the terminals of the device, d) exposing the terminals and the areas covered by the photopatternable lacquer By applying a semi-additive process, depositing conductor material on the free end surfaces of the terminals and forming a conductor pattern on at least one surface of the circuit board and the wiring between the terminals and the conductor structure; and f) removing the portions of the conductor layer which do not belong to the conductor structure.
    Thanks to the invention, the "wiring " Embedded components on the same position or level as the embedding done so that the circuit boards can be made thinner and the above-mentioned problems of risk of detachment do not arise.
    It is advisable to remove the areas of the conductor layer in step f) by flash-etching.
    In view of the additional function of the photostructurable lacquer as a constituent of the finished lyre plate, it is advantageous if the photostructurable lacquer used in step c) is an epoxy-based lacquer.
    In a particularly favorable variant of the method according to the invention can be provided that in step b) the device is embedded using an adhesive layer in a recess of the circuit board, wherein the adhesive layer completely surrounds all surfaces of the device, except those with the terminals, and substantially extends to the level of the surface of the circuit board, in which lie the end faces of the terminals.
    The stated objects are also achieved with a printed circuit board of the type specified above, in which according to the invention the surfaces of the connections and the conductor tracks of the conductor layer lie in one plane, the adhesive layer completely surrounds all surfaces of the component, with the exception of those with the terminals, the spaces between the connections of the component are filled with a cured, photostructurable lacquer and on the end faces of the terminals and on a conductor layer of the printed circuit board in the region of the conductor tracks an additional conductor layer is applied.
    In a preferred embodiment, it is provided that the cured, photostructurable lacquer covers the free end faces of the adhesive layer between the outer wall of the component and the inner wall of the recess of the printed circuit board.
    The invention together with further advantages is described in more detail below with reference to an exemplary embodiment of the method or the printed circuit board, which is illustrated in the drawing. In this show
    1 in a section through a section of a manufactured in the first steps of the process core with an embedded component,
    2 shows the structure of FIG. 1 after application of a photostructurable lacquer, FIG.
    3 shows the structure after exposure and development of the photopatternable lacquer,
    4 shows the structure after deposition of further conductor material by applying a semi-additive process and
    Fig. 5 shows the structure of the finished circuit board after etching away a portion of the conductive pads.
    With reference to the figures, the method according to the invention and a circuit board according to the invention will now be explained. Here, under the term "Core" used below, in the context of the present description to understand a cured prepreg with a conductor layer (copper layer) on at least one surface.
    Fig. 1 shows a part of a core 1, which consists of an insulating layer 2, for example consisting of a prepreg material commonly used in the printed circuit board industry, such as FR 4, and an upper conductor layer 3 and a lower conductor layer 4. It should be noted at this point that the terms " top " and " bottom " only refer to the illustrations in the drawings and used for ease of description. For example, layer thicknesses are 100 pm for the insulating layer 2 and 1 to 5 pm, typically 2 pm, for the upper and lower conductor layer 3 and 4, respectively.
    In the core 1, a recess 5 is formed, in which a component 6 is embedded using an adhesive layer 7, wherein the layer thickness of this adhesive layer, for example, 20 to 200 pm. The device 6, e.g. a semiconductor chip carries on an outer surface, terminals 8, e.g. Copper pads, wherein the adhesive layer 7, all the surfaces of the component 6, except those with the terminals 8, completely surrounds and extends substantially to the plane of the surface of the core 1, in which lie the end faces of the terminals 8, thus here the lower surface. As adhesive, for example, a solvent-free or low-solvent epoxy adhesive with a glass softening point between typically 120 ° to 150 ° C in question, which is printed in the recess 5, filled or injected. After assembly with the component 6, this adhesive is cured at temperatures between 110 ° to 150 ° C.
    In a next step, at least on the outer surface of the core 1 with the end faces of the terminals 8, an epoxy-based photostructurable lacquer 9 is applied, reference being made to FIG. Examples of suitable products or materials for this purpose are the paint XB7081 with the name Probelec® from Huntsman or the photoresist SU-8 from Microchem Corp. known from lithographic electroplating (LIGA). As can be seen, the paint 9 fills all spaces between the terminals 8 of the component 6 and also extends over the lower conductor layer 4th
    It is then possible to carry out structuring with a photolithographic process customary in printed circuit board production, the exposure first being carried out with a film masking or by LDI (laser direct imaging). As a result, after washing away with suitable chemicals, the structuring is developed and the material is completely cured. The curing is carried out by means of conventional curing methods, e.g. thermal curing, UV or IR curing, application of laser radiation, etc. The structuring or exposure takes place in such a way that the terminals 8, more precisely their end faces, are exposed, to which reference is made to FIG. This structuring process is carried out so that the cured, photostructurable coating 9 covers the free end faces of the adhesive layer 7 between the outer wall of the component 6 and the inner wall of the recess 5 of the Corel and the lower conductor layer 4 is exposed again.
    After this exposure and development, a semi-additive process for applying conductive material, i.A. Copper, made according to the desired structure. In this case, in the desired areas, in particular for conductor tracks, a layer 10 of conductor material is applied, which is also deposited to form connecting lines 11 from the end faces of the terminals 8, starting to the desired conductor structure. On the other hand, the lower conductor layer 4 is reinforced in the region of the desired conductor tracks or conductor structure. This result can be seen in FIG.
    Since bridges 4b still exist between the thickenings of the lower conductor layer 4 through the layer 10 which are to form the conductor tracks, the removal of these bridges 4b and other undesired conductor material takes place in a further step. This is preferably done by so-called "flash etching", which means the etching of the base copper foil and a small removal of the electrodeposited copper layers. This etching is done, for example, with an acid medium, e.g. HCl with the addition of H2O2 and stabilizers, whereby the small crystallites of the base film are dissolved much faster than the electrodeposited layers and a selective etching is achieved. After this process of ablation or etching, the surfaces or spaces between the terminals 9 are cleaned and the final traces 12 are free and finished, for which reference is made to Fig. 5, showing the finished circuit board 13 with the embedded and Ankontaktierten device 6 shows.
    In the example shown, only the patterning of the lower conductor layer 4 is described, but it should be clear that also the upper conductor layer 3 can be structured in the same way. It is also possible to form vias (conductive vias) between the two conductor layers, as well as further insulation and conductor layers can be constructed.
    It should finally be clear that the illustrations of FIGS. 1 to 5 generally show only sections of a larger printed circuit board structure, and in practice a plurality of components can be embedded at different locations on a printed circuit board and connected to conductor structures.
    权利要求:
    Claims (6)
    [1]
    1. A method for contacting a in a printed circuit board (13) embedded component (6), characterized by the following steps: a) providing a core (1), the at least one insulating layer (2) and at least one conductor layer (3, 4) b) embedding at least one component (6) in an insulating layer, wherein the terminals (8) of the component lie substantially in the plane of an outer surface of the core (1) having the at least one conductor layer (4), c) applying a photostructurable Lacquers (9) on the one outer surface, filling the spaces between the terminals (8) of the component (6), d) exposing the terminals (8) and the areas of the conductor layer (4) covered by the photopatternable lacquer (9) by exposure and developing the photostructurable varnish, e) depositing a layer (10) of conductor material on the free end faces of the terminals (8) by applying a semi-additive process ) and forming a conductor structure (12-12) at least on the one surface of the core (1) and the connecting lines (11) between the terminals and the conductor structure (12-12) and f) removing the not to the conductor structure (12-12) belonging areas of the conductor layer (4 + 10).
    [2]
    2. The method according to claim 1, characterized in that the removal of the regions of the conductor layer (4 + 10) in step f) is carried out by flash-etching.
    [3]
    3. The method according to claim 1 or 2, characterized in that the photostructurable lacquer (9) used in step c) is an epoxy-based lacquer.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that in step b) the component (6) is embedded using an adhesive layer (7) in a recess of the core (1), wherein the adhesive layer, all surfaces of the device, except those with the terminals (8), completely surrounds and extends substantially to the plane of the surface of the circuit board (13), in which lie the end faces of the terminals.
    [5]
    5. printed circuit board (13) with at least one insulating layer (2) and at least one structured conductor layer (4 + 10) with conductor tracks (12), with at least one in the insulating layer using an adhesive layer (7) in a recess (5) of the circuit board embedded component (6) whose connections lie substantially in the plane of an outer surface of the printed circuit board having the at least one conductor layer and with conductive connections (11) between the terminals of the component and conductor tracks (12) of the conductor layer, characterized in that the surfaces of Connections (11) and the conductor tracks (12) of the conductor layer (4 + 10) lie in one plane, the adhesive layer (9) all surfaces of the component (6), except those with the terminals (8) completely surrounds the spaces between the terminals (8) of the component (6) are filled with a hardened, photostructurable lacquer (9) and on the end faces of the terminals (8) and an additional conductor layer (10) is applied on a conductor layer (4) of the printed circuit board in the region of the conductor tracks (12).
    [6]
    6. Printed circuit board (13) according to claim 5, characterized in that the cured, photostructurable lacquer (9) covers the free end faces of the adhesive layer (11) between the outer wall of the component (6) and the inner wall of the recess (5) of the printed circuit board.
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    公开号 | 公开日
    EP3111734B1|2018-01-24|
    US10187997B2|2019-01-22|
    AT515447B1|2019-10-15|
    US20170048984A1|2017-02-16|
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    CN106256019A|2016-12-21|
    WO2015127489A1|2015-09-03|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50152/2014A|AT515447B1|2014-02-27|2014-02-27|Method for contacting a component embedded in a printed circuit board and printed circuit board|ATA50152/2014A| AT515447B1|2014-02-27|2014-02-27|Method for contacting a component embedded in a printed circuit board and printed circuit board|
    CN201580023025.6A| CN106256019A|2014-02-27|2015-02-26|For the method that the component embedding printed circuit boardis engaged|
    US15/122,114| US10187997B2|2014-02-27|2015-02-26|Method for making contact with a component embedded in a printed circuit board|
    EP15716392.4A| EP3111734B1|2014-02-27|2015-02-26|Method for making contact with a component embedded in a printed circuit board|
    PCT/AT2015/050052| WO2015127489A1|2014-02-27|2015-02-26|Method for making contact with a component embedded in a printed circuit board|
    US16/184,470| US20190082543A1|2014-02-27|2018-11-08|Method for Making Contact with a Component Embedded in a Printed Circuit Board|
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